| 杜元开,柯雪,姚楚,江学良.化学通报,2023,86(9):1026-1034. |
| 高分子导热复合材料结构设计及性能研究进展 |
| Research progress in structural design and properties of polymer thermal conductive composites |
| 投稿时间：2022-12-13 修订日期：2023-04-09 |
| DOI： |
| 中文关键词: 高分子导热材料 导热填料 复合材料 导热网络结构 |
| 英文关键词:Thermal conductive polymer Thermal conductive filler Composite Thermal conductivity network structure |
| 基金项目:功能材料绿色制备与应用教育部重点实验室(湖北大学)2021年开放基金项目(202105)资助 |
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| 中文摘要: |
| 近年来，电子设备的需求逐渐向集成化、微型化发展，随之带来了愈发严重的发热问题已经成为了阻碍电子设备发展的重要因素之一。作为电子设备重要组成材料之一的高分子材料对优良导热性能的需求也越来越高，导热高分子复合材料的研究已经成为当前功能复合材料的重要发展方向。本文综述了高分子导热复合材料的发展趋势，介绍了当前选用填料法来制备单一填料、混杂填料高分子导热复合材料以及双逾渗结构、隔离结构等复杂多相结构的高分子导热复合材料的研究进展。重点介绍了通过多种导热填料的组合利用可以实现高性能导热高分子复合材料的制备。文章最后，对填料法高导热高分子复合材料的发展方向做出了简要展望。 |
| 英文摘要: |
| In recent years, the demand for electronic equipment has expanded into embedded and miniaturized devices, and with it, the thermal problem has become one of the most significant factors hindering the development of electronic devices. Since it is one of the important components of electronic devices, the demand for good thermal conductivity is also increasingly high. Research on polymer composites with thermal conductivity has become a major direction of development for functional composites. This paper reviews the trend in the development of thermally conductive polymer composites, and research advances in the preparation of thermally conductive polymer composites with single filler, mixed fillers, double percolation structure, segregated structure and other complex multiphase structures by filling method are presented. Specifically, the preparation of high-performance thermally conductive polymer composites is introduced through the combination of various thermally conductive fillers. Finally, the direction of development of high thermal conductivity polymer composites by packaging method is briefly explored. |
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