|
| 聚氨酯发泡材料在化学机械抛光中的应用进展 |
| Progress of Polyurethane foams in the application of Chemical-mechanical Polishing |
| 投稿时间：2025-02-22 修订日期：2025-04-12 |
| DOI： |
| 中文关键词: 化学机械抛光 抛光垫 聚氨酯 发泡材料 |
| 英文关键词:CMP, Polishing pad, Polyurethane, Foam material |
| 基金项目: |
|
| 摘要点击次数: 34 |
| 全文下载次数: 0 |
| 中文摘要: |
| 化学机械抛光(CMP)技术作为半导体晶片表面加工的关键技术之一，在集成电路制造过程中承担着各阶段表面平整化功能，可显著提高芯片的制造精度。作为CMP工艺中的核心耗材，抛光垫的性能直接决定了抛光效率与表面加工质量，其成本约占CMP工艺总成本的三分之一。聚氨酯(PU)材料因其独特的软段-硬段相分离结构，通过调节分子链段的结构组成与比例关系，可在较宽的范围内实现材料力学性能（如强度、硬度及柔韧性）的调控。更为重要的是，PU发泡材料所具有的微孔结构不仅能够提供抛光垫表面的粗糙度，还能有效维持抛光液中磨料颗粒的均匀分布，这种特殊的微相结构使其成为理想的抛光材料。本文综述了PU材料在抛光垫领域的研究进展与应用现状。PU材料凭借其优异的力学性能（如高抗拉强度、出色的断裂伸长率以及高抗撕裂性能），以及良好的摩擦学特性，成为抛光垫材料的理想选择。此外，通过优化模具设计，可根据实际需求定制不同的沟槽图案及样式，采用一步成型法高效制备目标产品，从而显著提高制造效率并降低生产成本。基于上述综合优势，PU材料在集成电路晶片制造领域展现出广阔的应用前景和显著的市场潜力。 |
| 英文摘要: |
| Chemical-mechanical polishing (CMP) technology is one of the key technologies in semiconductor wafer surface processing, which is used for surface flattening in various stages of integrated circuit manufacturing process and can significantly improve the manufacturing accuracy of chips. As the core consumables in the CMP process, the performance of the polishing pad directly determines the polishing efficiency and surface processing quality, and its cost accounts for about one-third of the total cost of the CMP process. Due to its unique soft segment and hard segment phase separation structure, polyurethane (PU) material can realize the control of mechanical properties (such as strength, hardness, and flexibility) in a wide range by adjusting the structural composition and proportion of molecular chain segments. More importantly, the microporous structure of PU foam material can not only provide the roughness of the surface of the polishing pad, but also effectively maintain the uniform distribution of abrasive particles in the polishing fluid. This special microphase structure makes it an ideal polishing material. This paper reviews the application research progress of PU in the field of polishing pad. PU material with its excellent mechanical properties (such as high tensile strength, excellent elongation at break and high tear resistance), as well as good tribological properties, become the ideal choice for polishing pad materials. In addition, by optimizing the mold design, different groove patterns and styles can be customized according to actual needs, and the target products can be efficiently prepared by one-step forming method, thus significantly improving manufacturing efficiency and reducing production costs. Owing to the above comprehensive advantages, PU material has shown broad application prospects and significant market potential in the field of integrated circuit chip manufacturing. |
| 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|